Further Enhances Industry Leadership in Multi-Level Cell Storage
Builds
on X4 Expertise in 2D NAND
SAN JOSE, Calif.--(BUSINESS WIRE)--
Western Digital Corp. (NASDAQ: WDC) today announced its successful
development of four bits per cell, X4, flash memory architecture
offering on 64-layer 3D NAND, BiCS3, technology. Building on its
pioneering innovation of X4 for 2D NAND technology and past success in
commercializing it, the company has now developed X4 for 3D NAND by
leveraging its deep vertical integration capabilities. These include
silicon wafer processing, device engineering to provide sixteen distinct
data levels in every storage node, and system expertise for overall
flash management. BiCS3 X4 technology delivers an industry-leading
storage capacity of 768 gigabits on a single chip, a 50 percent increase
from the prior 512 gigabit chip that was enabled with the three bits per
cell (X3) architecture. Western Digital will showcase removable products
and solid-state drives built with BiCS3 X4 and systems capabilities in
August at the Flash Memory Summit in Santa Clara, California.
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Western Digital announces its successful development of four bits per cell, X4, flash memory architecture offering on 64-layer 3D NAND, BiCS3, technology. (Photo: Business Wire)
"The implementation of X4 architecture on BiCS3 is a significant
development for Western Digital as it demonstrates our continued
leadership in NAND flash technology, and it also enables us to offer an
expanded choice of storage solutions for our customers," said Dr. Siva
Sivaram, executive vice president, Memory Technology, Western Digital.
"The most striking aspect in today's announcement is the use of
innovative techniques in the X4 architecture that allows our BiCS3 X4 to
deliver performance attributes comparable to those in BiCS3 X3. The
narrowing of the performance gap between the X4 and X3 architectures is
an important and differentiating capability for us, and it should help
drive broader market acceptance of X4 technology over the next several
years."
This latest achievement follows a nearly three-decade long legacy of
industry firsts in flash innovation, including the industry's
multi-level cell (MLC) flash technologies using two bits (X2) and three
bits (X3) per cell.
The company expects to productize its 3D NAND X4 technology across
multiple end-use applications that can take advantage of the higher
capacity points supported by X4. Future generations of 3D NAND
technology, including the 96-layer BiCS4, are also expected to feature
X4 capabilities.
About Western Digital
Western Digital is an industry-leading provider of storage technologies
and solutions that enable people to create, leverage, experience and
preserve data. The company addresses ever-changing market needs by
providing a full portfolio of compelling, high-quality storage solutions
with customer-focused innovation, high efficiency, flexibility and
speed. Our products are marketed under the HGST, SanDisk and WD brands
to OEMs, distributors, resellers, cloud infrastructure providers and
consumers. Financial and investor information is available on the
company's Investor Relations website at investor.wdc.com.
Forward-Looking Statements
This news release contains certain forward-looking statements, including
expectations for 3D NAND technology, including its development,
capabilities, performance improvements, applications, capacities and
customers as well as its participation in the Flash Memory Summit that
are based on current expectations. There are a number of risks and
uncertainties that may cause these forward-looking statements to be
inaccurate including, among others: volatility in global economic
conditions; business conditions and growth in the storage ecosystem;
impact of competitive products and pricing; market acceptance and cost
of commodity materials and specialized product components; actions by
competitors; unexpected advances in competing technologies; our
development and introduction of products based on new technologies and
expansion into new data storage markets; risks associated with
acquisitions, mergers and joint ventures; difficulties or delays in
manufacturing; and other risks and uncertainties listed in the company's
filings with the Securities and Exchange Commission (the "SEC"),
including the company's Form 10-Q filed with the SEC on May 8, 2017, to
which your attention is directed. You should not place undue reliance on
these forward-looking statements, which speak only as of the date
hereof, and the company undertakes no obligation to update these
forward-looking statements to reflect subsequent events or circumstances.
Western Digital is a registered trademark or trademark of Western
Digital Corporation or its affiliates in the U.S. and/or other
countries. All other marks are the property of their respective owners.
© 2017 Western Digital Corporation or its affiliates. All rights
reserved.
1 gigabit = 1,000,000,000 bits. Actual user storage less.
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Western Digital Corp.
Investor Relations:
Bob Blair,
949.672.7834
robert.blair@wdc.com
or
Media:
Steve
Shattuck, 949.672.7817
steve.shattuck@wdc.com
Source: Western Digital Corp.
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